11.03.2020
March 2020 – Semikron’s MiniSKiiP – IGBT Generation 7
Published on: 11/03/2020
Scalable solutions without compromise, Semikron’s MiniSkiiP IGBT Generation 7 is leading the way
Semikron’s MiniSKiiP – IGBT Generation 7
MiniSKiiP reaches new levels utilising the latest generation IGBT 7 chips and proven Semikron packaging technologies.
The MiniSKiiP is setting new standards in power density and performance for low and medium-power motor drives. It’s combined with the well-known advantages of the MiniSKiiP SPRiNG technology and its easy assembly process, a new benchmark in performance has been set.
Unlike conventional soldered modules, where expensive soldering equipment and time-consuming solder processes are required, no dedicated tools are needed for MiniSKiiP assembly thanks to the single or two-screw connection. The printed circuit board (PCB), power module and heatsink are all assembled in a single step.
The MiniSKiiP platform has proven successful in all standard applications such as motor drives, servo drives, solar inverters, UPS systems and welding machines. Semikron’s MiniSKiiP platform has two decades of experience and has 45 million modules in the field.
Product Range
MiniSKiiP modules are designed for 600V/650V, 1200V and 1700V with 4A-400A nominal chip currents. In addition to CIB, sixpack, twin sixpack, H-bridge, half-bridge and 3-level topology, customer specific modules are also available, using the latest chip technologies such as IGBT 7 in 1200V, application optimised 650V chipsets and silicon carbide. For fast evaluation, lab test boards can be ordered for every module type.
Key Features
- Current range 4A to 400A for inverter power of up to 110kw with one product platform
- Comprehensive set up of topologies: CIB, sixpack, twelvepacks, H-bridge, half-bridge, 3-level, bridge rectifiers with brake chopper
- Solder-free SPRiNG technology for minimum assembly time thanks to single/two screw mounting
Semikron’s Solution for Motor Drives
Scalable without compromise
- One inverter design concept from 1 to 110kW, 100% PCB based: minimum assembly time with solder free SPRiNG technology; module, PCB and heatsink can be mounted in one simple step
- Easy and flexible PCB routing without pin holes
- Available with pre-applied high performance thermal paste for maximum output power
Example:
- 110kW inverter design replacing copper bus bars with high power PCBs
- Based on the Power Density Master: IGBT 7, silicon nitride and high performance thermal paste
- Systems cost savings of up to 18% with fewer materials used than in baseplate module solutions
- Same module sizes and contact technologies for all the components
GD Rectifiers is a UK distributor for Semikron, stocking a wide range of components, heat sinks and assemblies. GD Rectifiers has been a distributor for Semikron for over 55 years, servicing customers with world-leading power modules and systems in the medium output range.
For further information on Semikron’s MiniSKiiP IGBT 7 or to discuss your requirements, please call GD Rectifiers on: 01444 243 452 or email: enquiries@gdrectifiers.co.uk.
