02.07.2021
IXYS Product Change Notice
Published on: 02/07/2021
IXYS Integrated Circuits new product change notice with immediate effect
IXYS Integrated Circuits Division (ICD), now part of Littelfuse, is changing the mold compound used for the i4-PAC, ISOPLUS-264 and Super SIP packages. The mold compound for the i4-PAC and ISSOPLUS-264 packages is changing from the Samsung SL-73000JX to the Panasonic CV8400ZVS. The Super SIP package mold compound is changing from the Shin-Etsu KMC-2380G to the Panasonic CV8400ZVS.
There is no impact on quality or reliability and there is no change to the existing datasheets.
Part numbers of the affected devices are listed below:
CPC1708J
CPC1709J
CPC1718J
CPC1727J
CPC1777J
CPC1779J
CPC1786J
CPC1788J
CPC1908J
CPC1909J
CPC1918J
CPC1927J
CPC1967J
CPC1968J
CPC1977J
CPC1978J
CPC1979J
CPC1988J
CPC1998J
CPC40055ST
These changes are effective immediately.
For further information relating to this PCN notice, please contact GD Rectifiers on 01444 243 452 or email [email protected].